This study introduces an advanced defect inspection model that utilizes object detection techniques to identify defects in Flip Chip cross-section images. The model serves as a valuable tool for failure analysis (FA) engineers working with Chip-on-Wafer (CoW) products by enhancing inspection precision and accuracy. save time and costs. reduce human error. https://www.bekindtopets.com/super-value-Crushed-Turquoise-iPhone-14-Pro-Max-MagSafe-Case-p82210-mega-value/